CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAGING STRUCTURE HAVING THE SAME

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United States of America Patent

APP PUB NO 20240147629A1
SERIAL NO

18385707

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Abstract

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A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.

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Patent Owner(s)

Patent OwnerAddress
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDQINHUANGDAO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, YAN-LU Shenzhen, CN 23 10
LI, YANG Shenzhen,Guangdong, CN 1182 7549
LIU, LI-KUN Shenzhen, CN 13 5
WANG, JIAN Qinhuangdao, CN 1906 17240
ZHU, CHANG-HE Qinhuangdao, CN 2 0

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