PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
Apr 17, 2023
filing date -
Nov 2, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.
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