PLANAR PIEZOELECTRIC VIBRATION MODULE
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
May 23, 2023
filing date -
May 24, 2022
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Abstract
A planar piezoelectric vibration module includes an insulating bottom layer, a conductive layer, a piezoelectric assembly, and an insulating filling layer. The conductive layer is arranged on the insulating bottom layer and includes two conductive patterns that are insulated. The piezoelectric assembly is arranged on the conductive layer and includes a piezoelectric material layer, a first electrode including a first inner interdigital portion, a second electrode including a second inner interdigital portion, and an encapsulating material, where the first inner interdigital portion and the second inner interdigital portion penetrate through the piezoelectric material layer in a mutual interdigital arrangement manner, and the first electrode and the second electrode are electrically connected to the two conductive patterns, respectively. The insulating filling layer is arranged on the conductive layer and around the piezoelectric assembly. The planar piezoelectric vibration module has the advantage of achieving high-frequency and broadband transmission of sound waves.
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