METHOD FOR MANUFACTURING A SUBSTRATE FOR A RADIOFREQUENCY DEVICE
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
Jan 4, 2024
filing date -
Mar 26, 2018
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A process for fabricating a substrate for a radiofrequency device includes providing a piezoelectric substrate and a carrier substrate, depositing a dielectric layer on a surface of the piezoelectric substrate, assembling together the piezoelectric substrate and the carrier substrate with a polymerizable adhesive directly between the dielectric layer and the carrier substrate to form an assembled substrate, and polymerizing the polymerizable adhesive layer to form a polymerized layer bonding the piezoelectric substrate to the carrier substrate, the polymerized layer and the dielectric layer together forming an electrically insulating layer between the piezoelectric substrate and the carrier substrate,
First Claim
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