Importance

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Abstract

A sensor device includes a carrier having a via for guiding an electrical contact from a bottom surface to a top surface of the carrier. The device also includes an integrated circuit on the carrier, a sensor element, an optoelectronic component on the top surface of the carrier, and a first electrically conductive contact element on the via an electrically connected thereto. The device further includes a substantially opaque encapsulation material enclosing the sensor element, the optoelectronic component, and the first electrically conductive contact element such that a surface of the sensor element and of the optoelectronic component opposite the carrier is uncovered by the encapsulation material. The device additionally includes a first conductor track on the encapsulation material electrically connecting the first electrically conductive contact element and the integrated circuit, and a second conductor track on the encapsulation material electrically connecting the integrated circuit with the optoelectronic component.

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First Claim