INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
Jan 5, 2024
filing date -
Dec 28, 2018
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
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