SUBSTRATE CLEANING APPARATUS, SUBSTRATE DRYING APPARATUS, SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE PLACING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CHARGE AMOUNT CONTROL METHOD, AND CHARGE AMOUNT CONTROL PROGRAM

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United States of America Patent

APP PUB NO 20240145276A1
SERIAL NO

18497324

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate cleaning apparatus including: a substrate holding and rotating mechanism configured to hold and rotate a substrate; a cleaning liquid supplier configured to supply a cleaning liquid to the substrate; a cleaning member configured to come into contact with the substrate to clean the substrate; a charge amount adjustment apparatus capable of increasing and decreasing a charge amount of the substrate; a charge amount measuring instrument configured to measure the charge amount of the substrate; and a controller configured to control the charge amount adjustment apparatus according to the charge amount measured by the charge amount measuring instrument.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATIONOTA-KU TOKYO 144-8510

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIMORI, Yosuke Tokyo, JP 9 17

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3335716251501 - 1011 - 20020004000600080001000012000140001600018000200002200024000260002800030000320003400036000

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