METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

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United States of America Patent

APP PUB NO 20240145253A1
SERIAL NO

18407877

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Abstract

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A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etchin

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECH DRESDEN GMBH & CO KGNot Provided

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Butschkow, Christian München, DE 4 0
Cattaneo, Andrea Taufkirchen, DE 9 18
Feick, Henning Dresden, DE 43 1331
Heiss, Dominik München, DE 30 15
Kadow, Christoph Gauting, DE 42 143
Seidel, Uwe München, DE 26 406
Solomko, Valentyn München, DE 43 265
Steltenpohl, Anton München, DE 17 150
Taddiken, Hans München, DE 47 425

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