ION BEAM IMPLANTATION METHOD AND SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20240145247A1
SERIAL NO

18407587

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In an example, a substrate is oriented to a target axis, wherein a residual angular misalignment between the target axis and a preselected crystal channel direction in the substrate is within an angular tolerance interval. Dopant ions are implanted into the substrate using an ion beam that propagates along an ion beam axis. The dopant ions are implanted at implant angles between the ion beam axis and the target axis. The implant angles are within an implant angle range. A channel acceptance width is effective for the preselected crystal channel direction. The implant angle range is greater than 80% of a sum of the channel acceptance width and twofold the angular tolerance interval. The implant angle range is smaller than 500% of the sum of the channel acceptance width and twofold the angular tolerance interval.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AG85579 NEUBIBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HELL, Michael Erlangen, DE 25 16
JELINEK, Moriz Villach, AT 35 166
LEENDERTZ, Caspar MUENCHEN, DE 51 108
MLETSCHNIG, Kristijan Luka Villach, AT 8 1
SCHULZE, Hans-Joachim Taufkirchen, DE 693 4306

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