METHOD OF APPLYING A DIELECTRIC COATING ON A COMPONENT OF AN ELECTRICAL DEVICE
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
Oct 31, 2023
filing date -
Nov 2, 2022
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Abstract
A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process or a spin-on cladding process. The structure array has a plurality of features. The method may include applying a second layer of a second dielectric material on the first layer with an evaporation deposition process, a physical vapor deposition process (PVD), or a flux-controlled chemical vapor deposition (CVD) process. The first layer has a first thickness and the second layer has a second thickness that is greater than the first thickness.
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