BONDING SHEET

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United States of America Patent

APP PUB NO 20240139887A1
SERIAL NO

18281257

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A bonding sheet according to the present invention contains a matrix resin; solder particles; and a fluxing agent. The bonding sheet has a surface with a surface roughness Sa of 2.5 μm or less.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONOSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KATO, Masatoshi Ibaraki-shi, Osaka, JP 80 612
KOSAKA, Naofumi Ibaraki-shi, Osaka, JP 19 17
NITTA, Ayumi Ibaraki-shi, Osaka, JP 4 0

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