LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

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United States of America Patent

APP PUB NO 20240139863A1
SERIAL NO

18494242

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laser processing apparatus includes a laser oscillating mechanism for emitting pulsed laser beams. The laser oscillating mechanism includes a group setting section for establishing the number of pulsed laser beams to be applied to a workpiece until a time after which melted debris produced by the pulsed laser beams applied to the workpiece is solidified, and assigns the pulsed laser beams to a group, under conditions that, within a period of time which is shorter than a period of time in which the melted debris is produced, and within a period of time after which a plasma generated by the pulsed laser beam becomes extinct, a next pulsed laser beam is applied to the workpiece to sustain the plasma uninterruptedly to break growing debris, and a time interval setting section for establishing a time interval between the group and another group adjacent thereto.

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Patent Owner(s)

Patent OwnerAddress
DISCO CORPORATION13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANEKO, Yohei Tokyo, JP 31 88
KIRIHARA, Naotoshi Tokyo, JP 21 60
MORIKAZU, Hiroshi Tokyo, JP 131 1163
ODANAKA, Kentaro Tokyo, JP 31 102

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