COPPER PARTICLES AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
May 2, 2024
app pub date -
Feb 2, 2022
filing date -
Mar 30, 2021
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Copper particles are provided mainly containing a copper element. In the copper particles, a ratio (S1/B) of a first crystallite size S1 to a particle size B is 0.23 or less, where the first crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (111) plane of copper in X-ray diffraction measurement, and the particle size is calculated from a BET specific surface area. In the copper particles, a ratio (S1/S2) of the first crystallite size S1 to a second crystallite size S2 is 1.35 or less, where the second crystallite size is obtained using Scherrer equation from a full width at half maximum of a peak derived from (220) plane of copper in X-ray diffraction measurement. A method for manufacturing the copper particles is also provided.
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