Electronic Module, Especially Optical Transceiver Module
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United States of America Patent
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Issued Date -
Apr 25, 2024
app pub date -
Oct 10, 2023
filing date -
Oct 10, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to an electronic module, especially an optical transceiver module, including a casing, at least a portion of which consists of a thermally conductive material adapted to dissipate heat to the surrounding air or to a neighboring heat sink (heat dissipating portion); and a printed circuit board provided within the casing, the printed circuit board carrying at least one heat producing electronic device on a mounting surface thereof. A table-like heat dissipating element having one or more legs extending from a table top is provided on the mounting surface. The table top covers the at least one heat producing electronic device and the one or more legs contact the mounting surface in an area surrounding the at least one heat producing electronic device. An upper surface of the table top either directly or indirectly contacts an inner surface of the heat dissipating portion of the casing.
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