SEMICONDUCTOR MANUFACTURING EQUIPMENT
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United States of America Patent
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Issued Date -
Apr 25, 2024
app pub date -
Sep 28, 2023
filing date -
Sep 28, 2023
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Abstract
Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
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