METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20240136235A1
SERIAL NO

18556695

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Abstract

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A method for manufacturing a substrate according to the first disclosure includes immersing a substrate on which a plurality of circuit patterns are formed in pure water or a corrosive solution, applying voltage between the plurality of circuit patterns in a state in which the substrate is immersed in the pure water or the corrosive solution and determining the substrate to be a defective product when a tree is generated in the plurality of circuit patterns due to the voltage application and determining the substrate to be a non-defective product when the tree is not generated.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008310 ?1008310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUO, Mamoru Tokyo, JP 31 470
NAKAHARA, Kenta Tokyo, JP 16 30
NAKAMURA, Keiichi Tokyo, JP 116 1090

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