LIGNIN-FORMALDEHYDE RESINS, RELATED COMPOSITIONS, AND RELATED METHODS
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United States of America Patent
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Apr 25, 2024
app pub date -
Feb 4, 2022
filing date -
Feb 4, 2022
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Abstract
The disclosure relates to adhesive compositions, including non-crosslinked resins and crosslinked/cured adhesives joining substrates, as well as related methods for making the compositions and articles. Compared to a conventional phenol (P) and formaldehyde (F) resin, the disclosed methods and compositions use lignin (L), formaldehyde (F), and optionally higher aldehydes (A) as corresponding replacements to provide an analog to a conventional PF resin with biobased reactants. Due to the differing reactivity of the LF components compared to the PF components, the initial condensation reaction between ortho-reactive sites in the lignin and the aldehyde is controlled to prevent gelation of the aqueous reaction mixture while reacting substantially all of the LF reactants to provide a non-crosslinked resin reaction product. The resin reaction product can then be cured at high temperature/high pressure conditions to provide a crosslinked adhesive, for example joining two substrates.
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