MOLD PLATE COOLING ARRANGEMENT
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United States of America Patent
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Issued Date -
Apr 25, 2024
app pub date -
Jan 4, 2024
filing date -
Jan 4, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A fluid cooled mold plate is disclosed. The fluid cooled mold plate has a front side, a rear side, and a perimeter that extends between its front and rear sides. A cooling chamber is formed within the mold plate. The cooling chamber has a front wall, a rear wall, and a perimeter wall that extends between the front and rear walls. An inlet fluid duct extends from a first side of the mold plate perimeter to a first end of the cooling chamber and an outlet fluid duct extends from a second side of the mold plate perimeter to a second end of the cooling chamber. The cooling chamber is occupied by a turbulence generating dispersion mesh that is secured between the front and rear walls the cooling chamber.
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