HIGH-FREQUENCY COIL COMPONENT
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United States of America Patent
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Issued Date -
Apr 18, 2024
app pub date -
Oct 11, 2023
filing date -
Oct 14, 2022
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Abstract
A high-frequency coil component includes a sealing portion containing a resin and a plurality of hollow particles, and a coil portion composed of a wound conductive wire. The coil portion is sealed in the sealing portion. The resin includes a low-dielectric resin having a relative permittivity εr1 of 2.00 or more and less than 3.00 at 23±2° C. A mass of the resin is represented by Mr. A total mass of the plurality of hollow particles is represented by Mp. Mr/(Mr+Mp) is 25% or more and 85% or less.
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