PHASE SHIFT BLANKMASK AND PHOTOMASK FOR EUV LITHOGRAPHY

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United States of America Patent

APP PUB NO 20240126162A1
SERIAL NO

17989425

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Abstract

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Disclosed is a blankmask for EUV lithography, including a reflective film, a capping film and a phase shift film which are sequentially formed on a substrate. The phase shift film includes a first layer containing niobium (Nb) and chrome (Cr), and a second layer containing tantalum (Ta) and silicon (Si). In the first layer, the content of niobium (Nb) ranges from 20 to 50 at %, and the content of chrome (Cr) content ranges from 10 to 40 at %. The blankmask can implement an excellent resolution and NILS, and implement a low DtC.

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Patent Owner(s)

Patent OwnerAddress
S&S TECH CO LTD42 HOSANDONG-RO DALSEO-GU DAEGU 42714

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Yong-Dae Daegu, KR 11 58
LEE, Jong-Hwa Daegu, KR 104 1238
YANG, Chul-Kyu Daegu, KR 25 37

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