INTEGRATED CIRCUIT PACKAGE INCLUDING AN NTEGRATED SHUNT RESISTOR
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United States of America Patent
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Issued Date -
Apr 18, 2024
app pub date -
May 4, 2023
filing date -
Oct 18, 2022
priority date (Note) -
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Abstract
An integrated circuit (IC) package includes a partial leadframe including (a) a shunt resistor leadframe element including a pair of shunt resistor contacts and a shunt resistor conductively connected between the pair of shunt resistor contacts and (b) at least one external contact leadframe element separate from the shunt resistor leadframe element, the at least one external contact leadframe element allowing external contact to the IC package. The IC package also a mold encapsulation formed over the shunt resistor leadframe element, wherein the pair of shunt resistor contacts are externally contactable through the mold encapsulation.
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