COMPOUND EVAPORATIVE COOLING TOWER AND DATA CENTER
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United States of America Patent
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Issued Date -
Apr 18, 2024
app pub date -
Oct 16, 2023
filing date -
Oct 18, 2022
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Abstract
An embodiment of the present disclosure provides a compound evaporative cooling tower and a data center, relating to the field of cooling tower technology. The compound evaporative cooling tower includes an air-inlet grille, a precooling module, a first spray module, a cooling module, a direct evaporative heat exchanger, a second spray module, a water collector, and an outdoor fan. The precooling module is arranged on an inner side of the air-inlet grille. The first spray module is arranged above the precooling module, and the second spray module is arranged above the direct evaporative heat exchanger. The cooling module is arranged below the direct evaporative heat exchanger and includes a plurality of cooling sub-modules.
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