THERMAL BONDING FILM, METHOD FOR PRODUCING SAME, AND WATER TANK ADHESION STRUCTURE USING SAME FOR AIR-TO-WATER SOURCE HEAT PUMP
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United States of America Patent
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Issued Date -
Apr 18, 2024
app pub date -
Dec 15, 2021
filing date -
Feb 9, 2021
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Abstract
Disclosed is a water tank adhesion structure using thermal bonding film for air-to-water source heat pump, the thermal film, which is activated by the temperature of the hot water and is inserted between a hot water tank and insulation material for tight adhesion therebetween, activating when hot water is supplied, which is when insulation is actually necessary.
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