Package Structure and Electronic Device
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United States of America Patent
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Issued Date -
Apr 11, 2024
app pub date -
Sep 29, 2023
filing date -
Oct 8, 2022
priority date (Note) -
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Abstract
A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected to the first cabling layer or the second cabling layer. When the chip is short-circuited, the protection structure blows first.
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