MICROSTRAND INTERFACE LAYER FOR IMPROVED ENGINEERED WOOD PRODUCTS
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United States of America Patent
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Issued Date -
Apr 11, 2024
app pub date -
Dec 14, 2023
filing date -
Nov 8, 2021
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Abstract
An engineered wood based siding, cladding or panel with a microstrand interface layer (MIL) applied to the top of the main strand matrix layers to minimize telegraphing, add rigidity and strength, and provide an improved surface appearance. The MIL comprises microstrands applied to the surface of the strand matrix or mat during production, prior to deposition of a fines layer. The MIL prevents the loss of fines into the strand matrix, and helps prevent or eliminate strand telegraphing.
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