THIN FILM SUPPORT STRUCTURES
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United States of America Patent
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Issued Date -
Apr 11, 2024
app pub date -
Dec 18, 2023
filing date -
Jul 14, 2016
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Abstract
A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.
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