COMPONENT COOLER WITH SPRING MECHANISM
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United States of America Patent
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Issued Date -
Apr 4, 2024
app pub date -
Sep 29, 2022
filing date -
Sep 29, 2022
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Abstract
An apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. The apparatus further includes a first spring mechanism between the manifold and the heat transfer element. The first spring mechanism is configured to apply a first force to the heat transfer element.
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