Imaging Method, Sensor, 3D Shape Reconstruction Method and System
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United States of America Patent
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Apr 4, 2024
app pub date -
Nov 10, 2023
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Sep 29, 2021
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Abstract
This disclosure presents a novel smart complementary metal oxide semiconductor (CMOS) sensor that can detect the “bright” pixels and export the light intensity and location of the selected pixels only. The detecting function is achieved by applying a thresholding criteria method. A novel CMOS architecture is proposed. The FPA-implemented COMS is shared by two sets of column processing circuitry for selecting, processing and exporting the data from top half and bottom half of FPA respectively. The CMOS architecture comprises a re-routing scheme, multiple I/Os deployment, parallel-shifting FIFO memory buffers, and interleaved timing scheme.
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