SOLDER REFLOW APPARATUS
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United States of America Patent
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Issued Date -
Apr 4, 2024
app pub date -
Apr 19, 2023
filing date -
Oct 4, 2022
priority date (Note) -
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Abstract
A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.
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