HIGH-ENTROPY ALLOY AND MANUFACTURING METHOD THEREFOR

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United States of America Patent

APP PUB NO 20240110263A1
SERIAL NO

18376624

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Abstract

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The present disclosure relates to a high-entropy alloy and a manufacturing method therefor, and in particular, a high-entropy alloy and a manufacturing method therefor that comprises a multi-element alloy matrix and Cu, and comprises an alloy having a face-centered cubic (FCC)-based phase, such that the high-entropy alloy may have greater hardness and strength than an existing transition metal alloy while maintaining a FCC-based single phase, and has high lubricity.

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Patent Owner(s)

Patent OwnerAddress
LG ELECTRONICS INC128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336
KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION145 ANAM-RO SEONGBUK-GU SEOUL 02841

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BYEON, Dogyun Seoul, KR 1 0
JANG, Tae-Jin Seoul, KR 2 1
KIM, Joungwook Seoul, KR 7 0
KIM, Young-Mok Seoul, KR 14 39
SOHN, Seok-Su Seoul, KR 3 0
YANG, Eunsoo Seoul, KR 14 38

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