AI WIRING MATERIAL

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240110262A1
SERIAL NO

18275599

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy

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Patent Owner(s)

Patent OwnerAddress
NIPPON MICROMETAL CORPORATIONSAITAMA
NIPPON STEEL CHEMICAL & MATERIAL CO LTD14-1 SOTOKANDA 4-CHOME CHIYODA-KU TOKYO 101-0021

International Classification(s)

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  • 2022 Application Filing Year
  • H01L Class
  • 27731 Applications Filed
  • 8200 Patents Issued To-Date
  • 29.57 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ETO, Motoki Saitama, JP 28 37
KURIHARA, Yuto Saitama, JP 7 0
ODA, Daizo Saitama, JP 61 213
OYAMADA, Tetsuya Tokyo, JP 29 29
SUTO, Yuya Tokyo, JP 5 0
UNO, Tomohiro Tokyo, JP 109 711

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3335716251501 - 1011 - 20020004000600080001000012000140001600018000200002200024000260002800030000320003400036000

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