Method For Manufacturing Device
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Sep 25, 2023
filing date -
Sep 26, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing a device including an active layer and a support substrate bonded to the active layer on one surface side, the active layer including an element, an electrode configured to drive the element, a frame portion disposed around the element, and an electrode pad disposed in the frame portion and coupled to the electrode, the method including: forming a protective film at the other surface side of the frame portion and the other surface side of the element, the protective film being resistant to an etchant and including a first opening portion formed between an outer shape of the element and the frame portion and a second opening portion formed on the electrode pad; and forming a space between the element and the support substrate by etching the support substrate with the etchant passing through the first opening portion.
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