NON-VOLATILE MEMORY (NVM) CELL STRUCTURE TO INCREASE RELIABILITY

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United States of America Patent

APP PUB NO 20240107755A1
SERIAL NO

18534818

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Abstract

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Various embodiments of the present disclosure are directed towards a semiconductor structure including a first well region disposed within a substrate and comprising a first doping type. A conductive structure overlies the first well region. A pair of first doped regions is disposed within the first well region on opposing sides of the conductive structure. The pair of first doped regions comprise a second doping type opposite the first doping type. A pair of second doped regions is disposed within the first well region on the opposing sides of the conductive structure. The pair of second doped regions comprise the second doping type and are laterally offset from the pair of first doped regions by a non-zero distance.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shih-Hsien Zhubei City, TW 43 157
Ko, Chun-Yao Hsinchu City, TW 40 149
Tsui, Felix Ying-Kit Cupertino, US 70 246

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