SEMICONDUCTOR MEMORY DEVICE

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United States of America Patent

APP PUB NO 20240107742A1
SERIAL NO

17952657

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Abstract

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A semiconductor memory device includes a substrate, and a plurality of layers vertically stacked over the substrate. A first layer in the plurality of layers includes an active region extending in a first direction parallel to a top surface of the substrate. The semiconductor memory device also includes a first conductive line that extends vertically in a second direction perpendicular to the top surface of the substrate and penetrates through the active region. The semiconductor memory device also includes a capacitor including a first electrode that is disposed in the active region.

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Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPTAICHUNG CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Frederick Tainan City, TW 51 141
IKEDA, Noriaki Taichung City, TW 54 318
TANAKA, Yoshinori Taichung City, TW 689 9749

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