HIGH FREQUENCY MODULE, COMMUNICATION APPARATUS, AND METHOD FOR MANUFACTURING HIGH FREQUENCY MODULE
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Dec 7, 2023
filing date -
Jun 11, 2021
priority date (Note) -
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Abstract
An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.
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