METHOD FOR MANUFACTURING A CAP SUBSTRATE, METHOD FOR MANUFACTURING A HERMETICALLY HOUSED OPTOELECTRONIC DEVICE, AND HERMETICALLY HOUSED OPTOELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Aug 18, 2023
filing date -
Feb 19, 2021
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Abstract
A method includes the steps of: providing a mold substrate and a cover substrate that are bonded to each other, wherein a surface region of the mold substrate and/or of the cover substrate is structured so as to form an enclosed cavity between the cover substrate and the mold substrate; tempering the cover substrate and the mold substrate so as to decrease the viscosity of the glass material of the cover substrate, and providing an overpressure in the enclosed cavity compared to the surrounding atmosphere so as to cause, on the basis of the decreased viscosity of the glass material of the cover substrate and the overpressure in the enclosed cavity compared to the surrounding atmosphere, bulging of the glass material of the cover substrate starting from the enclosed cavity up to a stop area, spaced apart from the cover substrate, of a stop element so as to acquire a molded cover substrate with a cap element; and removing the stop element and the mold substrate from the molded cover substrate.
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