SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240105831A1
SERIAL NO

18180486

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes: a semiconductor chip having a first surface, a second surface, a first electrode provided on the first surface, a second electrode provided on the second surface, and a third electrode provided on the second surface; a first conductor including a fourth conductor and a fifth conductor; a conductive first connector provided between the first conductor and the first electrode; a second conductor including a sixth conductor and a seventh conductor; a conductive second connector provided between the second electrode and the sixth conductor; a third conductor including an eighth conductor, an intermediate conductor, and a ninth conductor, the intermediate conductor being provided between the eighth conductor and the ninth conductor, the eighth conductor being provided between the semiconductor chip and the intermediate conductor, and the intermediate conductor having a through hole; and a conductive third connector.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA KK〒1058001 東京都港区芝浦一丁目1番1号 TOKYO ?1058001

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INOUE, Daisuke Fujisawa Kanagawa, JP 269 2049
TAKAHASHI, Yoshiko Yokohama Kanagawa, JP 14 32
TSAI, Yuning Yokohama Kanagawa, JP 6 0

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