WOUND CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Dec 13, 2022
filing date -
Sep 28, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion. The protruding sealing element has a main sealing portion pressed by the surrounding concave position-limiting portion, and an auxiliary sealing portion protruding from the main sealing portion.
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