SENSOR PACKAGE AND ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Sep 27, 2023
filing date -
Sep 27, 2022
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Abstract
A sensor package includes a substrate, a light sensor disposed on the substrate, at least one optical filter disposed on the light sensor, and an optical functional layer that is light-permeable, is disposed on the substrate, covers the light sensor and the optical filter, and includes multiple light-scattering particles. The light sensor has a light receiving region, and receives light through the light receiving region. The optical filter covers the light receiving region. When the light passes through the optical filter within an incident angle range and is received by the light receiving region, the light sensor responds to a wavelength range of the light, and a response spectrum is obtained. Within the incident angle range, an absolute value of an offset measured at a crest of a waveform of the response spectrum is less than or equal to 10 nm. An electronic device is also provided.
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