CURABLE COMPOSITION, FILM FORMING METHOD AND ARTICLE MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Nov 9, 2023
filing date -
Jun 9, 2021
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Abstract
There is provided that a curable composition containing a polymerizable compound, a photopolymerization initiator, and solvent, wherein the polymerizable compound contains at least a compound having one of an aromatic structure, an aromatic heterocyclic structure, and an alicyclic structure, the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., in a state in which the solvent is removed, the curable composition has a viscosity of not less than 30 mPa·s and not more than 10,000 mPa·s at 23° C., and a content of the solvent with respect to the whole curable composition is not less than 70 vol % and not more than 95 vol %.
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