SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
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United States of America Patent
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Issued Date -
Mar 28, 2024
app pub date -
Sep 14, 2023
filing date -
Sep 26, 2022
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Abstract
A substrate cleaning device includes a chamber, a first processing part and a second processing part. The chamber forms a processing space including a first processing position and a second processing position. The first processing part performs a first process on a substrate disposed at the first processing position in the chamber. The second processing part performs a second process on the substrate disposed at the second processing position in the chamber. A main robot loads and unloads the substrate with respect to the substrate cleaning device by moving a hand holding the substrate. In addition, the main robot receives the substrate disposed at the first processing position by causing the hand to enter the processing space, transporting the substrate to the second processing position, and positioning the substrate.
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