LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION
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United States of America Patent
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Mar 28, 2024
app pub date -
Sep 19, 2023
filing date -
Sep 28, 2022
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Abstract
A lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.
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