THERMOELECTRIC ELEMENT
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Nov 30, 2021
filing date -
Dec 10, 2020
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Abstract
According to an embodiment, disclosed is a thermoelectric element comprising: an electrode; a semiconductor structure arranged on the electrode; a diffusion barrier layer arranged on the bottom surface of the semiconductor structure, and having an opening part; a metal layer arranged on the bottom surface of the diffusion barrier layer; and a conductive bonding layer arranged between the metal layer and the electrode, wherein a part of the metal layer extends to the inside of the opening part of the diffusion barrier layer so as to be electrically connected to the semiconductor structure.
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