COMPUTING CENTER AND METHOD
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Oct 12, 2020
filing date -
Oct 15, 2019
priority date (Note) -
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Abstract
Disclosed herein is a computing center that includes a computing system disposed in a chamber. The computing system includes a plurality of cooling elements and a plurality of processors, each processor thermally coupled to a cooling element of the plurality of cooling elements. The computing also center includes at least one heat pump disposed in the chamber; at least one gas-liquid exchanger disposed in the chamber. The also computing center includes a hot liquid circuit coupling the plurality of cooling elements to the gas-liquid exchanger, the hot liquid circuit further comprising a hot liquid connection on a wall of the chamber and a cold liquid circuit coupling the heat pump to the gas-liquid exchanger, wherein the heat pump is configured to extract thermal energy from the cold liquid circuit and supply it to the hot liquid circuit.
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