RADIO FREQUENCY TRANSMISSION FRONT-END MODULE AND ASSOCIATED MANUFACTURING METHOD
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United States of America Patent
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Mar 21, 2024
app pub date -
Sep 20, 2023
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Sep 21, 2022
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Abstract
An integration system and method for the manufacture of radio frequency transmission front-end modules with radio frequency integrated circuit(s) and self-biased magnetic component(s) integrated on a “Wafer Level Packaging”-type technology. This integration makes it possible to design efficient, compact and low-cost front-end modules.
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