ACOUSTIC WAVE DEVICE
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Nov 29, 2023
filing date -
Jun 1, 2021
priority date (Note) -
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Abstract
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h1, and a height of the second ground bumps is h2, n1<n2 and h1<h2.
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