SOLID-STATE IMAGING ELEMENT AND METHOD OF MANUFACTURING SAME

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United States of America Patent

APP PUB NO 20240096913A1
SERIAL NO

18257874

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided a solid-state imaging element capable of increasing a channel area of a pixel transistor and reducing a parasitic capacitance of a gate. A solid-state imaging element is a solid-state imaging element including pixels that photoelectrically convert incident light, and includes a substrate on which the pixels are provided, a first transistor provided in the pixels and including a first gate electrode portion embedded in a first direction from a first surface of the substrate toward a second surface of the substrate opposite to the first surface, a first gate insulating film provided between an active region of the substrate in which a channel of the first transistor is formed and a first side surface of the first gate electrode portion facing the active region, and a first insulating film provided on a second side surface of the first gate electrode portion other than the first side surface and thicker than the first gate insulating film, in which a depth of the first insulating film from the first surface to the second surface of the substrate is substantially the same as or deeper than a depth of the first gate electrode portion, and a width of an upper surface of the first gate electrode portion is wider than a width of a bottom surface of the first gate electrode portion in a cross section in the first direction.

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Patent Owner(s)

Patent OwnerAddress
SONY SEMICONDUCTOR SOLUTIONS CORPKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BABA, KOICHI KANAGAWA, JP 36 272
HIROSE, YOHEI KANAGAWA, JP 15 39
HONJO, AKIKO KANAGAWA, JP 23 24
KATAOKA, TOYOTAKA KANAGAWA, JP 20 259
KATO, AKIHIKO KANAGAWA, JP 65 481
KIMIZUKA, NAOHIKO KANAGAWA, JP 38 217
KUROBE, TOSHIHIRO KANAGAWA, JP 6 8
TOYOFUKU, TAKUYA KANAGAWA, JP 6 28

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