INTEGRATED CIRCUIT DEVICES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240096755A1
SERIAL NO

18462883

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated circuit device includes a first chip and a second chip. The first chip includes a first substrate including a through-via region, a prohibition region, and a device region, the prohibition region surrounding the through-via region in a plan view. The first chip further includes a through-via penetrating the first substrate in the through-via region, and a power gating cell disposed in the prohibition region. The second chip includes a second substrate, and a plurality of circuit blocks configured to receive power and/or signals through the through-via.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEON, Sangjoon Suwon-si, KR 1 0
CHOI, Jaeseung Suwon-si, KR 36 270
KANG, Heewon Suwon-si, KR 17 262
KIM, Byungsu Suwon-si, KR 9 3
PARK, Sunhee Suwon-si, KR 7 23

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