APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240096683A1
SERIAL NO

18368971

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments herein are generally directed to die cleaning frames for processing and handling singulated devices and methods related thereto. The die cleaning frames may be used advantageously to minimize contact with device surfaces during post-singulation processing and to facilitate a pick and place bonding process without touching the active side of the cleaned device. Thus, the die cleaning frames and methods described herein eliminate the need for undesirable contact with clean and prepared active sides of the devices during a direct placement die-to-wafer bonding process. In one embodiment, a carrier configured to support a singulated device in a die pocket region may include a carrier plate and a frame that surrounds the carrier plate and is integrally formed therewith. The carrier plate may include a first surface and an opposite second surface, and one or more sidewalls that define an opening disposed through and extending between the first and second surfaces. Each of the sidewalls may include one or more protuberances that collectively determine a rectangular boundary of the die pocket region. Some of the protuberances may include a die supporting surface that extends beneath the die pocket region.

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Patent Owner(s)

Patent OwnerAddress
ADEIA SEMICONDUCTOR BONDING TECH INCNot Provided

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Francis, Aaron Todd San Jose, US 2 0
Guevara, Gabriel Gilroy, US 1 0
Suwito, Dominik San Jose, US 10 281
Uzoh, Cyprian Emeka San Jose, US 382 12692
Workman, Thomas San Jose, US 29 822

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