PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
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United States of America Patent
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Issued Date -
Mar 21, 2024
app pub date -
Aug 29, 2023
filing date -
Sep 20, 2022
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Abstract
According to one embodiment, a pattern formation method includes holding a substrate on a suction chuck that an outer suction region for an outer edge portion of the substrate and an inner suction region for an inner region of the substrate. A partial shot region at an outer edge of the substrate has a first alignment mark in the inner region and a second alignment mark at the outer edge portion. While a template is being pressed against a resin film in the shot region, position alignment using the second and fourth alignment marks is performed by adjusting a suction force for the outer suction region for changing a warpage amount of the substrate while observing the second and fourth alignment marks through the template.
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